TC60G1224UE Module

Tensorcom’s TC60G1224UE Module is the newest member of its 60GHz product portfolio. The TC60G1224UE Module is an 802.11ad/WiGig USB 3.0 module for embedded applications that require Gigabit-per-second wireless communications. The TC60G1224UE Module, which measures 12.2mm x 24.2mm x 1.5mm, is a highly integrated module containing a USB3.0 Controller and PHY, a CMOS SoC comprised of an IEEE 802.11™ad-2012 compliant MAC, digital baseband and 60GHz PHY, and two pairs of embedded transmit and receive antennas. This module addresses the demanding small form factor, low power consumption and Gigabit-per-second performance requirements of a wide range of battery powered mobile and hand held devices.

Contact us now to obtain more information regarding the technical details, availability and pricing of the TC60G1224UE Module.

The TC60G1224UE Module is fabricated using TSMC’s 40nm standard CMOS process, and features:

  • a USB3.0/2.0 compliant interface for those applications that require a USB3.0/2.0 interface
  • Effective throughput data rates ranging from 320 Mbps when operating in MCS_1 to 1.08 Gbps when operating in MCS_7.
  • A choice of either end-fire antennas, which are suitable for placement in thin devices, or patch antennas for applications requiring antennas with a vertical orientation

TC60G1115GE SiP

Tensorcom’s Green SoC (GSoC™) – The lowest power complete 802.11ad solution

Tensorcom’s TC60G1115GE SiP continues to be the first 60GHz solution to meet the low power consumption requirements of battery powered mobile and hand-held devices. The TC60G1115GE SiP, which measures 11.3mm x 15.5mm x 1.5mm, is a full implementation of an 802.11™ad compliant MAC, digital baseband and 60 GHz PHY in a single CMOS chip that is mounted on a low-cost package that integrates two transmit antennas and two receive antennas. Tensorcom engineers designed the TC60G1115GE SiP to address the demanding small form factor, ultra-low power consumption and Gigabit-per-second performance requirements of a wide range of battery powered mobile and hand held devices.

Contact us now to obtain more information regarding the technical details, availability and pricing of the TC60G1115GE SiP.

The TC60G115GE SiP is fabricated using TSMC’s 40nm standard CMOS process, and features:

  • a General Purpose Memory Control (GPMC) interface for those applications that do not have a USB3.0 interface
  • < 370 mW peak power consumption when in transmit mode
  • < 550 mW peak power consumption when in receive mode
  • Effective throughput data rates ranging from 320 Mbps when operating in MCS_1 to 1.08 Gbps when operating in MCS_7.
  • A choice of either end-fire antennas, which are suitable for placement in thin devices, or patch antennas for applications requiring antennas with a vertical orientation

TC60G-USB3.0 Evaluation Board

The TC60G-USB3 Evaluation Board (EVB) is available for purchase by qualified individuals so that they may evaluate the capabilities of Tensorcom’s 60 GHz solution right out of the box. The TC60G-USB3 EVB includes:

  • Two TC60-USB3.0 Evaluation Boards (EVB), each of which is comprised of:
    • a USB3.0 device controller/PHY and a
    • TC60G1115GE SiP.
  • A CD containing these items:
    • Tensorcom’s 60GHz/USB Linux Driver object code
    • A Speed Test software application with Graphical User Interface that supports a variety of performance testing scenarios
    • A Flash Programming Utility that supports reprogramming the EVB’s flash with firmware updates
    • An EVK Operations Manual in PDF that describes how to setup, operate and test the EVK’s two EVBs.
  • Two USB3.0 cables (each 1 meter in length)
  • Two desktop tripods.

Contact us now to obtain more information regarding the technical details, availability and pricing of the TC60G-USB3 Evaluation Board.