TC60G-USB3.0 EVK

The TC60G-USB3.0 Evaluation Kit (EVK) is available for purchase by qualified individuals so that they may evaluate the capabilities of Tensorcom’s single chip, 60 GHz solution right out of the box.  The TC60G-USB3.0 EVK contains all the hardware, software and documentation needed to perform a variety of evaluation tests in the 60GHz frequency band such as maximum throughput, receiver sensitivity, beamforming and rate adaptation.

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TC60G70100UP PicoCell Platform

Tensorcom’s newest product offering, the TC60G70100UP PicoCell Platform, is for applications that require Gigabit-per-second wireless communications at ranges up to 100 or more meters. The TC60G70100UP PicoCell Platform is comprised of two high gain, 64-element Tx and Rx patch antennas, two PA_s and LNA_s, a highly integrated, low power, 802.11ad/WiGig 60GHz CMOS MAC/PHY and a USB3.0 Controller/PHY chip to form a complete WiGig/USB3.0 solution for small cell, 60GHz applications that require high data rate connectivity

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TC60G1224UE Module with Penny

TC60G1224UE Module

The TC60G1224UE Module, which measures 12.2mm x 24.2mm x 1.5mm, is a highly integrated module containing a USB3.0 Controller and PHY, a CMOS SoC comprised of an IEEE 802.11™ad compliant MAC, digital baseband and 60GHz PHY along with two pairs of embedded end-fire  transmit and receive antennas. This module is for those embedded applications requiring a module with a small form factor, low power consumption, Gigabit-per-second performance and a USB3.0 interface.

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TC60G1115GE Module

Tensorcom’s Green SoC (GSoC™) – The lowest power complete 802.11ad solution

Tensorcom’s TC60G1115GE Module continues to be the first single chip, 60GHz solution to meet the low power consumption requirements of battery powered mobile and hand-held devices. The TC60G1115GE Module, which measures 11.3mm x 15.5mm x 1.5mm, is a full implementation of an 802.11™ad compliant MAC, digital baseband and 60 GHz PHY in a single CMOS chip that is mounted on a low-cost package that integrates two pairs of end-fire transmit and receive antennas. Tensorcom engineers designed the TC60G1115GE Module to address the demanding small form factor, ultra-low power consumption and Gigabit-per-second performance requirements of a wide range of battery powered mobile and hand held devices.

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TC60G1109GX SiP

The TC60G1109GX System-in-Package (SiP), which measures 11mm x 9.0mm x 1.5mm, is a highly integrated, ultra-low power 802.11ad/WiGig SiP that enables Gigabit/s communications for custom designs. The TC60G1109GX SiP integrates a complete 802.11ad/WiGig 60GHz CMOS system on chip (SoC)comprised of an IEEE 802.11™ad-2012 compliant MAC, digital baseband and 60GHz PHY along with two integrated Tx transmission lines and two integrated Rx transmission lines, which enables customers to attach custom antennas of their own design. This system in package is for those custom board designs requiring a SiP with a small form factor, low power consumption and Gigabit-per-second performance.

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